GEN2000 MBE System
Superior Throughput, Longer Campaigns, Smaller Footprint and Cluster Tool Wafer Handling
The GEN2000庐 MBE system provides superior throughput, longer campaigns, smaller footprint and cluster tool wafer handling. It is the ideal choice for high-volume manufacturing of wireless telecommunications devices such as HBTs and pHEMTs, and emerging applications requiring multi-6″ production with low cost of ownership.
- Delivers industry’s lowest cost per wafer
- Superior design enables 40 percent to 60 percent smaller footprint than comparable MBE systems
- Modular architecture allows for up to two growth modules, increasing throughput or allowing processing of incompatible materials
- Easy maintenance maximizes uptime
- Optional bulkhead installation optimizes cleanroom space
- Incorporates the industry’s most innovative, reliable system hardware, sources and components